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Reliability of Graphene-based Films Used for High Power Electronics Packaging

Huang, Shirong (author)
Shanghai University
Zhang, Yong, 1982 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Wang, Nan, 1988 (author)
Chalmers tekniska högskola,Chalmers University of Technology
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Wang, N. (author)
Shanghai University
Fu, Yifeng, 1984 (author)
Chalmers tekniska högskola,Chalmers University of Technology
Ye, Lilei (author)
SHT Smart High-Tech AB
Liu, Johan, 1960 (author)
Chalmers tekniska högskola,Chalmers University of Technology
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 (creator_code:org_t)
ISBN 9781467379991
2015
2015
English.
In: 16th International Conference on Electronic Packaging Technology, ICEPT 2015, Changsha, China, 11-14 August 2015. - 9781467379991 ; , s. 852-855
  • Conference paper (peer-reviewed)
Abstract Subject headings
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  • Graphene-base film was fabricated with chemical conversion process, including graphene oxide (GO) prepared by Hummer's method, graphene oxide reduced with L-ascorbic acid (LAA), graphene based film deposited by vacuum filtration process. Meanwhile, the functionalization of the graphene-based film was performed to decrease the thermal interface resistance between the graphene-based film and substrate. Characterization data showed that the graphene-based film possessed high reliability after 500 hours under 85°C aging test. In summary, the graphene-based film can be a promising solution in thermal management of high power electronics.

Subject headings

TEKNIK OCH TEKNOLOGIER  -- Materialteknik (hsv//swe)
ENGINEERING AND TECHNOLOGY  -- Materials Engineering (hsv//eng)

Keyword

reliability test
electronic packaging
graphene-based film

Publication and Content Type

kon (subject category)
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